Shorform of products >>
Power%20Semiconductor%20Assemblies
>>
Assembiles%20of%20(B6C)2%20Series
Series
Type Applicationgs
Notes
na
na
na
Type
-V
VN
-I
d
Cooling method
Device type
Rate output current
Cooling condition
Device voltage
Outline
I
d
(A)
(V)
*(B6C)2x-xxx-xxxFA
Air Cooling
Modules
80-150
wind speed¡Ý6m/s ambient temperature¡Ü40¡ãC
100-2000
outline
*(B6C)2x-xxx-xxxFB
Air Cooling
Modules
200-260
wind speed¡Ý6m/s ambient temperature¡Ü40¡ãC
100-2000
outline
(B6C)2x-xxx-xxxFE
Air Cooling
Capsule types devices
800-1200
wind speed¡Ý6m/s ambient temperature¡Ü40¡ãC
100-2000
outline
(B6C)2x-xxx-xxxFF
Air Cooling
Capsule types devices
1500-2000
wind speed¡Ý6m/s ambient temperature¡Ü40¡ãC
100-2000
outline
Remark
Busbar should be connected outer
Code for circult connection
HUBEI TECH SEMICONDUCTORS.,LTD. All Rights Reserved